Equipment Subrack. Subrack Structure. Overall Structure of Subrack. Overall Structure of OptiX BWS 320G Subrack

The subrack of OptiX BWS 320G system is divided into three parts: the upper part is interface area, all the electrical interfaces are connected from here; the middle part is used to accommodate the boards, totally 15 slots available; the lower part is fiber pigtail installed area. Subrack structure is shown in Figure 2-1.

Note: 1.Subrack interface area; 2.Slot; 3.Optical fiber connector in subrack.

Figure 2-1 Overall Structure of OptiX BWS 320G Subrack

The interface area of OptiX BWS 320G subrack is shown in Figure 2-2:

Note: 1. Ethernet; 2. F&f ; 3. RS-232; 4. Power alarm; 5. Power; 6. Three PHONE interface; 7. fan; 8. RS-422; 9. F2; 10. F1; 11. BNC; 12. X.25.

Figure 2-2 OptiX BWS 320G subrack interface area

As shown in this figure:

n  Ethernet interface: RJ-45 network card module connector used as TMN network management or local management interface.

n  F&f interface: DB9-type connector that possesses the properties of RS-232C interfaces and can be used as local management interface.

n  RS-232 interfaces: DB9-type connectors which are configurable serial interfaces provided for users.

n  ALARM interface: subrack alarm output port.

n  POWER interface: supply power to subrack.

n  PHONE interfaces: Three RJ-11 phone module connectors used as engineering orderwire call interfaces utilizing E1 and E2 bytes of the supervisory channel.

n  FAN interface: DB9-type fan subrack alarm interface.

n  RS-422 interfaces: DB9-type connectors which are configurable serial interfaces.

n  F1 interface: DB9-type connector used as co-directional 64kbit/s data communication interface provided.

n  F2 interface: DB9-type connector which has RS-232 properties, not available..

n  BNC interface: it has the same function of the RJ-45 Ethernet interface. But these two interfaces can't be used simultaneously.

n  X.25 interface: DB25-type connector used as an OAM interface, not available now.

The board area of OptiX BWS 320G system subrack is shown in Figure 2-3.

Figure 2-3 Board area of OptiX BWS 320G system subrack

1. IU: board area for common interfaces

IU1~IU13 can be inserted with the following boards:

n  TWF (STM-64 Transmitting Optical Wavelength Conversion Unit with FEC Function)

n  TWC (STM-16 Transmitting Optical Wavelength Conversion Unit)

n  LWC (STM-16 Line Wavelength Conversion Unit)

n  RWF (STM-64 Receiving Optical Wavelength Conversion Unit with FEC Function)

n  RWC (STM-16 Receiving Optical Wavelength Conversion Unit)

n  LWE (Gigabit Ethernet Wavelength Conversion Unit)

n  OLP (Optical Line Protection Unit)

n  MS2 (Dual Directional Supervising Unit For Multi-channel)

n  MR2 (2-Channel Add/Drop Unit)

n  SCA (Supervising Channel Access Unit)

IU2~IU13 can be inserted with the following boards:

n  OCU (Optical STM-16/64 Combiner Unit with FEC function)

n  WLA (WDM Optical Line Amplifier Unit)

n  WBA (WDM Optical Booster Amplifier Unit)

n  WPA (WDM Optical Preamplifier Unit)

n  D16 (16-channel Demultiplexer Unit)

n  M16 (16-channel Multiplexer Unit)

IU4~IU13 can be inserted with the following boards:

n  D32 (32-channel Demultiplexer Unit)

n  M32 (32-channel Multiplexer Unit)

IU10~IU13 can be inserted with the following boards:

n  SC2 (Dual Directional Optical Supervising Channel Unit)

n  SC1 (Single Directional Optical Supervising Channel Unit)

2. SCC: System control and communication unit

System control and communication board is inserted here.

3. OHP: Overhead processing unit

Overhead processing board is inserted here.

615mm (height)×530mm (width)×284mm (depth).

37kg.

Equipment Subrack..................................................................................................................................................... 1

2.1 Subrack Structure........................................................................................................................................... 1

2.1.1 Overall Structure of Subrack.................................................................................................................. 1

2.1.2 Interface Area....................................................................................................................................... 3

2.1.3 Board Area.......................................................................................................................................... 4

2.2 Physical Parameters........................................................................................................................................ 7

2.2.1 Dimensions.......................................................................................................................................... 7

2.2.2 Weight................................................................................................................................................. 7